bez PVN
ar PVN
Tehniskie Dokumenti
Specifikācija
Brand
STMicroelectronicsMaximum Overload Pressure
2000kPa
Product Type
MEMS Pressure Sensor
Sensor Type
MEMS
Mount Type
Surface
Package Type
HLGA-10L
Pin Count
10
Minimum Supply Voltage
1.7V
Maximum Operating Pressure
1.26 kPa
Maximum Supply Voltage
3.6V
Accuracy
±0.1 hPa
Maximum Operating Temperature
125°C
Height
0.8mm
Length
2mm
Standards/Approvals
No
Series
LPS22CHTR
Minimum Operating Pressure
260hPa
Minimum Output Voltage
0.2V
Minimum Operating Temperature
-40°C
Automotive Standard
No
Produkta Apraksts
The STMicroelectronics LPS22CH is an ultra-compact piezo resistive absolute pressure sensor which function as a digital output barometer. The device comprises a sensing element and an IC interface which communicates through I²C or SPI from the sensing element to the application. The LPS22CH is available in a full-mold, holed LGA package (HLGA).
Noliktavas stāvoklis patreiz nav pieejams
€ 14,75
€ 2,95 Katrs (Paka ir 5) (bez PVN)
€ 17,85
€ 3,57 Katrs (Paka ir 5) (Ieskaitot PVN)
Standarts
5
€ 14,75
€ 2,95 Katrs (Paka ir 5) (bez PVN)
€ 17,85
€ 3,57 Katrs (Paka ir 5) (Ieskaitot PVN)
Noliktavas stāvoklis patreiz nav pieejams
Standarts
5
Tehniskie Dokumenti
Specifikācija
Brand
STMicroelectronicsMaximum Overload Pressure
2000kPa
Product Type
MEMS Pressure Sensor
Sensor Type
MEMS
Mount Type
Surface
Package Type
HLGA-10L
Pin Count
10
Minimum Supply Voltage
1.7V
Maximum Operating Pressure
1.26 kPa
Maximum Supply Voltage
3.6V
Accuracy
±0.1 hPa
Maximum Operating Temperature
125°C
Height
0.8mm
Length
2mm
Standards/Approvals
No
Series
LPS22CHTR
Minimum Operating Pressure
260hPa
Minimum Output Voltage
0.2V
Minimum Operating Temperature
-40°C
Automotive Standard
No
Produkta Apraksts
The STMicroelectronics LPS22CH is an ultra-compact piezo resistive absolute pressure sensor which function as a digital output barometer. The device comprises a sensing element and an IC interface which communicates through I²C or SPI from the sensing element to the application. The LPS22CH is available in a full-mold, holed LGA package (HLGA).