bez PVN
ar PVN

Tehniskie Dokumenti
Specifikācija
Brand
STMicroelectronicsUnbalance Impedance
50Ω
Product Type
Chip Balun
Balance Impedance
50Ω
Maximum Insertion Loss
1.85dB
Mount Type
Surface
Pin Count
4
Maximum Frequency
2.5GHz
Minimum Frequency
2400MHz
Minimum Operating Temperature
-40°C
Package Type
CSPG
Maximum Operating Temperature
105°C
Length
1.385mm
Standards/Approvals
No
Series
BALF-NRG-02D3
Produkta Apraksts
Baluns use STs process integrating high-quality RF passive components on a single glass substrate. As well as balanced/unbalanced conversion, they can also integrate a matching network in a footprint smaller than 1 mm² for the complete function. ST's latest balun-the 1.2 mm² footprint BALF-NRG-02D3-is customized for our BlueNRG-1 and new BlueNRG-2 transceivers, reducing RF complexity and providing optimized link budget
This device is an ultra-miniature balun which integrates matching network and harmonics filter. Matching impedance has been customized for the BlueNRG ST transceiver. The BALF-NRG-02D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance
Noliktavas stāvoklis patreiz nav pieejams
€ 11,95
€ 0,239 Katrs (Paka ir 50) (bez PVN)
€ 14,46
€ 0,289 Katrs (Paka ir 50) (Ieskaitot PVN)
Standarts
50
€ 11,95
€ 0,239 Katrs (Paka ir 50) (bez PVN)
€ 14,46
€ 0,289 Katrs (Paka ir 50) (Ieskaitot PVN)
Noliktavas stāvoklis patreiz nav pieejams
Standarts
50
| Daudzums | Vienības cena | Per Iepakojums |
|---|---|---|
| 50 - 450 | € 0,239 | € 11,95 |
| 500 - 2450 | € 0,211 | € 10,55 |
| 2500 - 4950 | € 0,188 | € 9,40 |
| 5000+ | € 0,162 | € 8,10 |
Tehniskie Dokumenti
Specifikācija
Brand
STMicroelectronicsUnbalance Impedance
50Ω
Product Type
Chip Balun
Balance Impedance
50Ω
Maximum Insertion Loss
1.85dB
Mount Type
Surface
Pin Count
4
Maximum Frequency
2.5GHz
Minimum Frequency
2400MHz
Minimum Operating Temperature
-40°C
Package Type
CSPG
Maximum Operating Temperature
105°C
Length
1.385mm
Standards/Approvals
No
Series
BALF-NRG-02D3
Produkta Apraksts
Baluns use STs process integrating high-quality RF passive components on a single glass substrate. As well as balanced/unbalanced conversion, they can also integrate a matching network in a footprint smaller than 1 mm² for the complete function. ST's latest balun-the 1.2 mm² footprint BALF-NRG-02D3-is customized for our BlueNRG-1 and new BlueNRG-2 transceivers, reducing RF complexity and providing optimized link budget
This device is an ultra-miniature balun which integrates matching network and harmonics filter. Matching impedance has been customized for the BlueNRG ST transceiver. The BALF-NRG-02D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance