bez PVN
ar PVN
Tehniskie Dokumenti
Specifikācija
Brand
SamtecNumber of Contacts
40
Product Type
PCB Socket
Number of Rows
4
Sub Type
Board-to-Board
Pitch
1.27mm
Current
2.5A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Connector System
Board-to-Board
Series
SOLC
Minimum Operating Temperature
-55°C
Row Pitch
1.27mm
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Material
Bronze
Contact Plating
Gold
Standards/Approvals
No
Produkta Apraksts
The SOLC Series of FourRay SMT high density Sockets from samtec are a staggered quad row design. Contact and row pitch is 1.27 mm with a 0.635 mm offset in the contacts from row to row. This range of SOLC Series high density Sockets have 0.75 μm Gold plating on the contacts and 0.075 μm Gold plating on the tails. The above board height of these SOLC Series high density Sockets is 4.06 mm, with a mated height of 6.35 mm when using the corresponding TOLC high density terminal strips.
For mating TOLC high density terminal strips see stock number 765-6354 typical.
Noliktavas stāvoklis patreiz nav pieejams
€ 338,00
Katrs (tiek piegadats Tubina) (bez PVN)
€ 408,98
Katrs (tiek piegadats Tubina) (Ieskaitot PVN)
Industriālais iepakojums (Penālis)
20
€ 338,00
Katrs (tiek piegadats Tubina) (bez PVN)
€ 408,98
Katrs (tiek piegadats Tubina) (Ieskaitot PVN)
Noliktavas stāvoklis patreiz nav pieejams
Industriālais iepakojums (Penālis)
20
Tehniskie Dokumenti
Specifikācija
Brand
SamtecNumber of Contacts
40
Product Type
PCB Socket
Number of Rows
4
Sub Type
Board-to-Board
Pitch
1.27mm
Current
2.5A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Connector System
Board-to-Board
Series
SOLC
Minimum Operating Temperature
-55°C
Row Pitch
1.27mm
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Material
Bronze
Contact Plating
Gold
Standards/Approvals
No
Produkta Apraksts
The SOLC Series of FourRay SMT high density Sockets from samtec are a staggered quad row design. Contact and row pitch is 1.27 mm with a 0.635 mm offset in the contacts from row to row. This range of SOLC Series high density Sockets have 0.75 μm Gold plating on the contacts and 0.075 μm Gold plating on the tails. The above board height of these SOLC Series high density Sockets is 4.06 mm, with a mated height of 6.35 mm when using the corresponding TOLC high density terminal strips.
For mating TOLC high density terminal strips see stock number 765-6354 typical.