bez PVN
ar PVN
Tehniskie Dokumenti
Specifikācija
Brand
SamtecNumber of Contacts
30
Product Type
PCB Socket
Number of Rows
4
Sub Type
High Density Socket
Pitch
635μm
Current
1.34A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Vertical
Stacking Height
5mm
Connector System
Board-to-Board
Voltage
219V
Series
ADF6
Minimum Operating Temperature
-55°C
Row Pitch
960μm
Maximum Operating Temperature
125°C
Contact Material
Copper Alloy
Contact Plating
Tin over Nickel, Gold
Standards/Approvals
EU RoHS, EU REACH, CHINA RoHS
Izcelsmes valsts
United States
Produkta Apraksts
The Samtec Connector is a low profile, ultra-slim surface mount socket. Edge Rate® contact system optimized for signal integrity performance. Supports 56 Gbps PAM4 (28 Gbps NRZ) applications.
Noliktavas stāvoklis patreiz nav pieejams
€ 2 350,00
€ 23,50 Katrs (tiek piegadats Lente) (bez PVN)
€ 2 843,50
€ 28,435 Katrs (tiek piegadats Lente) (Ieskaitot PVN)
100
€ 2 350,00
€ 23,50 Katrs (tiek piegadats Lente) (bez PVN)
€ 2 843,50
€ 28,435 Katrs (tiek piegadats Lente) (Ieskaitot PVN)
Noliktavas stāvoklis patreiz nav pieejams
100
| Daudzums | Vienības cena | Per Lente |
|---|---|---|
| 100 - 100 | € 23,50 | € 2 350,00 |
| 200+ | € 22,20 | € 2 220,00 |
Tehniskie Dokumenti
Specifikācija
Brand
SamtecNumber of Contacts
30
Product Type
PCB Socket
Number of Rows
4
Sub Type
High Density Socket
Pitch
635μm
Current
1.34A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Vertical
Stacking Height
5mm
Connector System
Board-to-Board
Voltage
219V
Series
ADF6
Minimum Operating Temperature
-55°C
Row Pitch
960μm
Maximum Operating Temperature
125°C
Contact Material
Copper Alloy
Contact Plating
Tin over Nickel, Gold
Standards/Approvals
EU RoHS, EU REACH, CHINA RoHS
Izcelsmes valsts
United States
Produkta Apraksts
The Samtec Connector is a low profile, ultra-slim surface mount socket. Edge Rate® contact system optimized for signal integrity performance. Supports 56 Gbps PAM4 (28 Gbps NRZ) applications.