Tehniskie dokumenti
Specifikācija
Brand
TE ConnectivityGender
Female
For Use With
AMPMODU MOD IV Connector Housing
Series
AMPMODU MOD V
Minimum Wire Size mm²
0.2mm²
Termination Method
Crimp
Maximum Wire Size mm²
0.6mm²
Minimum Wire Size AWG
24AWG
Contact Plating
Gold
Maximum Wire Size AWG
20AWG
Contact Material
Phosphor Bronze
Maximum Contact Resistance
12mΩ
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+105°C
Produkta apraksts
Mod V Contact
A rang of TE Connectivity High Contact Pressure (HCP) Contacts for AMPMODU V connectors.
2.54mm TE Connectivity AMPMODU™ Range – Style 2 (European)
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.
Noliktavas stāvoklis patreiz nav pieejams
Lūdzu pārbaudiet vēlreiz vēlāk
€ 297,00
€ 0,297 Katrs (tiek piegadats Rulli) (bez PVN)
€ 359,37
€ 0,359 Katrs (tiek piegadats Rulli) (Ieskaitot PVN)
Industriālais iepakojums (Rullis)
1000
€ 297,00
€ 0,297 Katrs (tiek piegadats Rulli) (bez PVN)
€ 359,37
€ 0,359 Katrs (tiek piegadats Rulli) (Ieskaitot PVN)
Industriālais iepakojums (Rullis)
1000
Pirkt iepakojumos
Daudzums | Vienības cena | Per Rullis |
---|---|---|
1000 - 2900 | € 0,297 | € 29,70 |
3000 - 7400 | € 0,266 | € 26,60 |
7500 - 14900 | € 0,236 | € 23,60 |
15000+ | € 0,213 | € 21,30 |
Tehniskie dokumenti
Specifikācija
Brand
TE ConnectivityGender
Female
For Use With
AMPMODU MOD IV Connector Housing
Series
AMPMODU MOD V
Minimum Wire Size mm²
0.2mm²
Termination Method
Crimp
Maximum Wire Size mm²
0.6mm²
Minimum Wire Size AWG
24AWG
Contact Plating
Gold
Maximum Wire Size AWG
20AWG
Contact Material
Phosphor Bronze
Maximum Contact Resistance
12mΩ
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+105°C
Produkta apraksts
Mod V Contact
A rang of TE Connectivity High Contact Pressure (HCP) Contacts for AMPMODU V connectors.
2.54mm TE Connectivity AMPMODU™ Range – Style 2 (European)
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.