TDK 330nF Multilayer Ceramic Capacitor MLCC, 250V dc V, ±10% , SMD

RS noliktavas nr.: 916-3059PRažotājs: TDKRažotāja kods: C3225X7T2E334K200AA
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Tehniskie dokumenti

Specifikācija

Brand

TDK

Capacitance

330nF

Voltage

250V dc

Package/Case

1210 (3225M)

Mounting Type

Surface Mount

Dielectric

X7T

Tolerance

±10%

Dimensions

3.2 x 2.5 x 2mm

Length

3.2mm

Depth

2.5mm

Height

2mm

Series

C

Minimum Operating Temperature

-55°C

Terminal Type

Surface Mount

Maximum Operating Temperature

+125°C

Produkta apraksts

TDK Type 1210 Series C3225

MLCC C Series is a monolithic structure that ensures superior mechanical strength and reliability.
High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.

Noliktavas stāvoklis patreiz nav pieejams

Lūdzu pārbaudiet vēlreiz vēlāk

Noliktavas stāvoklis patreiz nav pieejams

€ 0,459

Katrs (tiek piegadats Rulli) (bez PVN)

€ 0,555

Katrs (tiek piegadats Rulli) (Ieskaitot PVN)

TDK 330nF Multilayer Ceramic Capacitor MLCC, 250V dc V, ±10% , SMD
Izvēlēties iepakojuma veidu

€ 0,459

Katrs (tiek piegadats Rulli) (bez PVN)

€ 0,555

Katrs (tiek piegadats Rulli) (Ieskaitot PVN)

TDK 330nF Multilayer Ceramic Capacitor MLCC, 250V dc V, ±10% , SMD
Noliktavas stāvoklis patreiz nav pieejams
Izvēlēties iepakojuma veidu

Pirkt iepakojumos

DaudzumsVienības cenaPer Rullis
20 - 80€ 0,459€ 9,18
100 - 180€ 0,298€ 5,96
200 - 480€ 0,276€ 5,52
500 - 980€ 0,252€ 5,04
1000+€ 0,23€ 4,60

Tehniskie dokumenti

Specifikācija

Brand

TDK

Capacitance

330nF

Voltage

250V dc

Package/Case

1210 (3225M)

Mounting Type

Surface Mount

Dielectric

X7T

Tolerance

±10%

Dimensions

3.2 x 2.5 x 2mm

Length

3.2mm

Depth

2.5mm

Height

2mm

Series

C

Minimum Operating Temperature

-55°C

Terminal Type

Surface Mount

Maximum Operating Temperature

+125°C

Produkta apraksts

TDK Type 1210 Series C3225

MLCC C Series is a monolithic structure that ensures superior mechanical strength and reliability.
High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.