Tehniskie dokumenti
Specifikācija
Brand
WinslowPitch
0.5 mm, 2.54 mm
End 1
10 Pin Female SOP
End 2
10 Pin Male DIP
End 1 Number of Contacts
10
End 2 Number of Contacts
10
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Izcelsmes valsts
United Kingdom
Produkta apraksts
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
€ 35,50
€ 7,10 Katrs (Paka ir 5) (bez PVN)
€ 42,96
€ 8,591 Katrs (Paka ir 5) (Ieskaitot PVN)
5
€ 35,50
€ 7,10 Katrs (Paka ir 5) (bez PVN)
€ 42,96
€ 8,591 Katrs (Paka ir 5) (Ieskaitot PVN)
Noliktavas stāvoklis patreiz nav pieejams
5
Noliktavas stāvoklis patreiz nav pieejams
Daudzums | Vienības cena | Per Iepakojums |
---|---|---|
5 - 120 | € 7,10 | € 35,50 |
125 - 370 | € 6,40 | € 32,00 |
375 - 995 | € 5,70 | € 28,50 |
1000 - 1995 | € 5,00 | € 25,00 |
2000+ | € 4,65 | € 23,25 |
Tehniskie dokumenti
Specifikācija
Brand
WinslowPitch
0.5 mm, 2.54 mm
End 1
10 Pin Female SOP
End 2
10 Pin Male DIP
End 1 Number of Contacts
10
End 2 Number of Contacts
10
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Izcelsmes valsts
United Kingdom
Produkta apraksts
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.