TE Connectivity Z-PACK HM Series Straight Through Hole Mount PCB Socket, 3-Contact, Solder Termination

RS noliktavas nr.: 165-0967Ražotājs: TE ConnectivityRažotāja kods: 5-5223955-2
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Tehniskie dokumenti

Specifikācija

Number Of Contacts

3

Type

Board to Board

Mounting Type

Through Hole

Body Orientation

Straight

Termination Method

Solder

Current Rating

1.15A

Voltage Rating

250 V

Series

Z-PACK HM

Contact Material

Copper

Izcelsmes valsts

China

Produkta apraksts

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

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Noliktavas stāvoklis patreiz nav pieejams

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€ 270,00

€ 4,50 Katrs (Tubina ir 60) (bez PVN)

€ 326,70

€ 5,445 Katrs (Tubina ir 60) (Ieskaitot PVN)

TE Connectivity Z-PACK HM Series Straight Through Hole Mount PCB Socket, 3-Contact, Solder Termination

€ 270,00

€ 4,50 Katrs (Tubina ir 60) (bez PVN)

€ 326,70

€ 5,445 Katrs (Tubina ir 60) (Ieskaitot PVN)

TE Connectivity Z-PACK HM Series Straight Through Hole Mount PCB Socket, 3-Contact, Solder Termination
Noliktavas stāvoklis patreiz nav pieejams

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Tehniskie dokumenti

Specifikācija

Number Of Contacts

3

Type

Board to Board

Mounting Type

Through Hole

Body Orientation

Straight

Termination Method

Solder

Current Rating

1.15A

Voltage Rating

250 V

Series

Z-PACK HM

Contact Material

Copper

Izcelsmes valsts

China

Produkta apraksts

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more