Tehniskie dokumenti
Specifikācija
Brand
TE ConnectivityGender
Female
For Use With
AMPMODU MOD IV Connector Housing
Series
AMPMODU MOD V
Minimum Wire Size mm²
0.03mm²
Termination Method
Crimp
Maximum Wire Size mm²
0.09mm²
Contact Plating
Tin
Minimum Wire Size AWG
32AWG
Contact Material
Phosphor Bronze
Maximum Wire Size AWG
28AWG
Maximum Contact Resistance
12mΩ
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+105°C
Produkta apraksts
Mod V Contact
A rang of TE Connectivity High Contact Pressure (HCP) Contacts for AMPMODU V connectors.
2.54mm TE Connectivity AMPMODU™ Range – Style 2 (European)
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.
Noliktavas stāvoklis patreiz nav pieejams
Lūdzu pārbaudiet vēlreiz vēlāk
€ 0,231
Katrs (tiek piegadats lepakojuma) (bez PVN)
€ 0,28
Katrs (tiek piegadats lepakojuma) (Ieskaitot PVN)
100
€ 0,231
Katrs (tiek piegadats lepakojuma) (bez PVN)
€ 0,28
Katrs (tiek piegadats lepakojuma) (Ieskaitot PVN)
100
Pirkt iepakojumos
Daudzums | Vienības cena | Per Maiss |
---|---|---|
100 - 400 | € 0,231 | € 23,10 |
500 - 900 | € 0,192 | € 19,20 |
1000 - 2400 | € 0,167 | € 16,70 |
2500 - 4900 | € 0,141 | € 14,10 |
5000+ | € 0,129 | € 12,90 |
Tehniskie dokumenti
Specifikācija
Brand
TE ConnectivityGender
Female
For Use With
AMPMODU MOD IV Connector Housing
Series
AMPMODU MOD V
Minimum Wire Size mm²
0.03mm²
Termination Method
Crimp
Maximum Wire Size mm²
0.09mm²
Contact Plating
Tin
Minimum Wire Size AWG
32AWG
Contact Material
Phosphor Bronze
Maximum Wire Size AWG
28AWG
Maximum Contact Resistance
12mΩ
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+105°C
Produkta apraksts
Mod V Contact
A rang of TE Connectivity High Contact Pressure (HCP) Contacts for AMPMODU V connectors.
2.54mm TE Connectivity AMPMODU™ Range – Style 2 (European)
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.