TDK 2.2μF Multilayer Ceramic Capacitor MLCC, 100V dc V, ±20% , SMD

RS noliktavas nr.: 740-7764PRažotājs: TDKRažotāja kods: C3225X7R2A225M230AB
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Tehniskie dokumenti

Specifikācija

Brand

TDK

Capacitance

2.2µF

Voltage

100V dc

Package/Case

1210 (3225M)

Mounting Type

Surface Mount

Dielectric

X7R

Tolerance

±20%

Dimensions

3.2 x 2.5 x 2.3mm

Length

3.2mm

Depth

2.5mm

Height

2.3mm

Series

C

Maximum Operating Temperature

+125°C

Minimum Operating Temperature

-55°C

Terminal Type

Surface Mount

Produkta apraksts

TDK Type 1210 Series C3225

MLCC C Series is a monolithic structure that ensures superior mechanical strength and reliability.
High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.

Noliktavas stāvoklis patreiz nav pieejams

Lūdzu pārbaudiet vēlreiz vēlāk

Noliktavas stāvoklis patreiz nav pieejams

€ 0,363

Katrs (tiek piegadats Rulli) (bez PVN)

€ 0,439

Katrs (tiek piegadats Rulli) (Ieskaitot PVN)

TDK 2.2μF Multilayer Ceramic Capacitor MLCC, 100V dc V, ±20% , SMD
Izvēlēties iepakojuma veidu

€ 0,363

Katrs (tiek piegadats Rulli) (bez PVN)

€ 0,439

Katrs (tiek piegadats Rulli) (Ieskaitot PVN)

TDK 2.2μF Multilayer Ceramic Capacitor MLCC, 100V dc V, ±20% , SMD
Noliktavas stāvoklis patreiz nav pieejams
Izvēlēties iepakojuma veidu

Pirkt iepakojumos

DaudzumsVienības cenaPer Rullis
10 - 40€ 0,363€ 3,63
50 - 90€ 0,29€ 2,90
100 - 240€ 0,254€ 2,54
250 - 490€ 0,217€ 2,17
500+€ 0,199€ 1,99

Tehniskie dokumenti

Specifikācija

Brand

TDK

Capacitance

2.2µF

Voltage

100V dc

Package/Case

1210 (3225M)

Mounting Type

Surface Mount

Dielectric

X7R

Tolerance

±20%

Dimensions

3.2 x 2.5 x 2.3mm

Length

3.2mm

Depth

2.5mm

Height

2.3mm

Series

C

Maximum Operating Temperature

+125°C

Minimum Operating Temperature

-55°C

Terminal Type

Surface Mount

Produkta apraksts

TDK Type 1210 Series C3225

MLCC C Series is a monolithic structure that ensures superior mechanical strength and reliability.
High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.