Tehniskie dokumenti
Specifikācija
Brand
MurataInductance
270 nH
Maximum dc Current
110mA
Package/Case
1005
Length
1mm
Depth
0.5mm
Height
0.5mm
Dimensions
1 x 0.5 x 0.5mm
Tolerance
±5%
Maximum DC Resistance
4.94Ω
Series
LQG15HS
Maximum Self Resonant Frequency
400MHz
Minimum Quality Factor
8
Inductor Construction
Wire-Wound
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Produkta apraksts
Murata 0402 LQG15HS Series High Frequency Chip Inductors
LQGH15HS inductors from Murata are general use multilayer surface mount inductors. Despite a lower Q factor than wire wound equivalents, the multilayer construction provides excellent balance between rated current, size and L value tolerance among others.
LQGH15HS SMD inductors are highly reliable and suitable for application in chokes, WLAN networks, RF circuit matching and mobile communication equipment resonance.
Noliktavas stāvoklis patreiz nav pieejams
Lūdzu pārbaudiet vēlreiz vēlāk
€ 0,037
Katrs (tiek piegadats Rulli) (bez PVN)
€ 0,045
Katrs (tiek piegadats Rulli) (Ieskaitot PVN)
Industriālais iepakojums (Rullis)
100
€ 0,037
Katrs (tiek piegadats Rulli) (bez PVN)
€ 0,045
Katrs (tiek piegadats Rulli) (Ieskaitot PVN)
Industriālais iepakojums (Rullis)
100
Tehniskie dokumenti
Specifikācija
Brand
MurataInductance
270 nH
Maximum dc Current
110mA
Package/Case
1005
Length
1mm
Depth
0.5mm
Height
0.5mm
Dimensions
1 x 0.5 x 0.5mm
Tolerance
±5%
Maximum DC Resistance
4.94Ω
Series
LQG15HS
Maximum Self Resonant Frequency
400MHz
Minimum Quality Factor
8
Inductor Construction
Wire-Wound
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Produkta apraksts
Murata 0402 LQG15HS Series High Frequency Chip Inductors
LQGH15HS inductors from Murata are general use multilayer surface mount inductors. Despite a lower Q factor than wire wound equivalents, the multilayer construction provides excellent balance between rated current, size and L value tolerance among others.
LQGH15HS SMD inductors are highly reliable and suitable for application in chokes, WLAN networks, RF circuit matching and mobile communication equipment resonance.