Molex MicroClasp Series Right Angle Through Hole PCB Header, 12 Contact(s), 2.0mm Pitch, 2 Row(s), Shrouded
Technical Document
Specifications
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
12
Number Of Rows
2
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Series Number
55959
Current Rating
3.0A
Voltage Rating
250.0 V
Country of Origin
Japan
Product details
Double Row Right Angle Header
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
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Stock information temporarily unavailable.
€ 130.20
€ 0.651 Each (Supplied in a Box) (Exc. Vat)
€ 157.54
€ 0.788 Each (Supplied in a Box) (inc. VAT)
Production pack (Box)
200
€ 130.20
€ 0.651 Each (Supplied in a Box) (Exc. Vat)
€ 157.54
€ 0.788 Each (Supplied in a Box) (inc. VAT)
Stock information temporarily unavailable.
Production pack (Box)
200
| Quantity | Unit price | Per Box |
|---|---|---|
| 200 - 740 | € 0.651 | € 6.51 |
| 750 - 2990 | € 0.588 | € 5.88 |
| 3000 - 5990 | € 0.559 | € 5.59 |
| 6000+ | € 0.53 | € 5.30 |
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Technical Document
Specifications
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
12
Number Of Rows
2
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Series Number
55959
Current Rating
3.0A
Voltage Rating
250.0 V
Country of Origin
Japan
Product details
Double Row Right Angle Header
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products