Molex Micro-Fit 3.0 Series Straight Through Hole PCB Header, 4 Contact(s), 3.0mm Pitch, 1 Row(s), Shrouded

RS noliktavas nr.: 670-4745Ražotājs: MolexRažotāja kods: 43650-0416
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Tehniskie dokumenti

Specifikācija

Brand

Molex

Series

MICRO-FIT 3.0

Pitch

3.0mm

Number Of Contacts

4

Number Of Rows

1

Body Orientation

Straight

Shrouded/Unshrouded

Shrouded

Connector System

Wire to Board

Mounting Type

Through Hole

Termination Method

Solder

Contact Plating

Gold

Contact Material

Brass

Series Number

43650

Current Rating

5.0A

Voltage Rating

250.0 V

Produkta apraksts

Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with PCB Polarizing Peg, 43650 Series

Micro-Fit 3.0 3mm pitch wire to board single row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx15, xx16 and xx17 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series

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Noliktavas stāvoklis patreiz nav pieejams

Lūdzu pārbaudiet vēlreiz vēlāk

Noliktavas stāvoklis patreiz nav pieejams

€ 1,80

Katrs (Paka ir 5) (bez PVN)

€ 2,178

Katrs (Paka ir 5) (Ieskaitot PVN)

Molex Micro-Fit 3.0 Series Straight Through Hole PCB Header, 4 Contact(s), 3.0mm Pitch, 1 Row(s), Shrouded
Izvēlēties iepakojuma veidu

€ 1,80

Katrs (Paka ir 5) (bez PVN)

€ 2,178

Katrs (Paka ir 5) (Ieskaitot PVN)

Molex Micro-Fit 3.0 Series Straight Through Hole PCB Header, 4 Contact(s), 3.0mm Pitch, 1 Row(s), Shrouded
Noliktavas stāvoklis patreiz nav pieejams
Izvēlēties iepakojuma veidu

Pirkt iepakojumos

DaudzumsVienības cenaPer Iepakojums
5 - 95€ 1,80€ 9,00
100 - 370€ 1,25€ 6,25
375 - 1495€ 1,15€ 5,75
1500+€ 0,934€ 4,67

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Tehniskie dokumenti

Specifikācija

Brand

Molex

Series

MICRO-FIT 3.0

Pitch

3.0mm

Number Of Contacts

4

Number Of Rows

1

Body Orientation

Straight

Shrouded/Unshrouded

Shrouded

Connector System

Wire to Board

Mounting Type

Through Hole

Termination Method

Solder

Contact Plating

Gold

Contact Material

Brass

Series Number

43650

Current Rating

5.0A

Voltage Rating

250.0 V

Produkta apraksts

Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with PCB Polarizing Peg, 43650 Series

Micro-Fit 3.0 3mm pitch wire to board single row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx15, xx16 and xx17 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more