Tehniskie dokumenti
Specifikācija
Brand
MolexSeries
MICRO-FIT 3.0
Pitch
3.0mm
Number Of Contacts
8
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Series Number
43045
Current Rating
5.0A
Voltage Rating
250.0 V
Gender
Male
Produkta apraksts
Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with PCB Polarizing Peg, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx12, xx13 and xx14 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Molex Micro-Fit 3.0 Series
Noliktavas stāvoklis patreiz nav pieejams
Lūdzu pārbaudiet vēlreiz vēlāk
€ 1,70
Katrs (tiek piegadats lepakojuma) (bez PVN)
€ 2,057
Katrs (tiek piegadats lepakojuma) (Ieskaitot PVN)
Industriālais iepakojums (Maiss)
100
€ 1,70
Katrs (tiek piegadats lepakojuma) (bez PVN)
€ 2,057
Katrs (tiek piegadats lepakojuma) (Ieskaitot PVN)
Industriālais iepakojums (Maiss)
100
Pirkt iepakojumos
Daudzums | Vienības cena | Per Maiss |
---|---|---|
100 - 370 | € 1,70 | € 8,50 |
375 - 1495 | € 1,60 | € 8,00 |
1500+ | € 1,30 | € 6,50 |
Tehniskie dokumenti
Specifikācija
Brand
MolexSeries
MICRO-FIT 3.0
Pitch
3.0mm
Number Of Contacts
8
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Series Number
43045
Current Rating
5.0A
Voltage Rating
250.0 V
Gender
Male
Produkta apraksts
Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with PCB Polarizing Peg, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx12, xx13 and xx14 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.