Var tikt piemērotas papildus transporta izmaksas

MG Chemicals 8329 TCS Liquid Thermal Adhesive, 50 ml

RS noliktavas nr.: 918-5021Ražotājs: MG ChemicalsRažotāja kods: 8329TCS-50ML
brand-logo
View all in Adhesives

Tehniskie dokumenti

Specifikācija

Adhesive Type

Conductive Adhesive

Trade Name

8329 TCS

Application

Industrial, Thermal Management

Material Compatibility

Ceramic, Glass, Metal, Plastic

Product Form

Liquid

Package Type

Can

Package Size

50 ml

Cure Time

20 min

Maximum Operating Temperature

+200°C

Operating Temperature Range

-70 → +200 °C

Odour

Slight

Specific Gravity

2.41

Minimum Operating Temperature

-70°C

Izcelsmes valsts

Canada

Produkta apraksts

MG Chemicals 8329 Slow Cure Conductive Adhesives

The MG Chemicals 8329TCS is a slow cure thermal conductive epoxy adhesive with excellent bonding strength and good thermal transfers is used for thermal management of high-powered electronics and LEDs. Once cured, the epoxy adhesive is inert under normal conditions so resists water and salt exposure.

Noliktavas stāvoklis patreiz nav pieejams

Lūdzu pārbaudiet vēlreiz vēlāk

Noliktavas stāvoklis patreiz nav pieejams

€ 96,00

Katrs (bez PVN)

€ 116,16

Katrs (Ieskaitot PVN)

MG Chemicals 8329 TCS Liquid Thermal Adhesive, 50 ml

€ 96,00

Katrs (bez PVN)

€ 116,16

Katrs (Ieskaitot PVN)

MG Chemicals 8329 TCS Liquid Thermal Adhesive, 50 ml
Noliktavas stāvoklis patreiz nav pieejams

Tehniskie dokumenti

Specifikācija

Adhesive Type

Conductive Adhesive

Trade Name

8329 TCS

Application

Industrial, Thermal Management

Material Compatibility

Ceramic, Glass, Metal, Plastic

Product Form

Liquid

Package Type

Can

Package Size

50 ml

Cure Time

20 min

Maximum Operating Temperature

+200°C

Operating Temperature Range

-70 → +200 °C

Odour

Slight

Specific Gravity

2.41

Minimum Operating Temperature

-70°C

Izcelsmes valsts

Canada

Produkta apraksts

MG Chemicals 8329 Slow Cure Conductive Adhesives

The MG Chemicals 8329TCS is a slow cure thermal conductive epoxy adhesive with excellent bonding strength and good thermal transfers is used for thermal management of high-powered electronics and LEDs. Once cured, the epoxy adhesive is inert under normal conditions so resists water and salt exposure.