Lite-On, LTV-217 DC Input Transistor Output Optocoupler, Surface Mount, 4-Pin SOIC
Tehniskie dokumenti
Specifikācija
Brand
Lite-OnMounting Type
Surface Mount
Output Device
Transistor
Maximum Forward Voltage
1.4V
Number of Channels
1
Number of Pins
4
Package Type
SOIC
Input Current Type
DC
Typical Rise Time
2µs
Maximum Input Current
50 mA
Isolation Voltage
3750 Vrms
Maximum Current Transfer Ratio
600%
Typical Fall Time
3µs
Special Features
Double Transfer Mold Technology, Hybrid Substrates That Require High Density Mounting, Programmable Controllers, System Appliance
Produkta apraksts
Transistor Output Optocouplers, Lite-On
Single, Dual and Quad format transistor output optocouplers from Lite-On. This wide range of products includes devices with AC or DC inputs, and both through-hole and surface-mounting package options are available.
Optocouplers, Lite-On
Noliktavas stāvoklis patreiz nav pieejams
Lūdzu pārbaudiet vēlreiz vēlāk
€ 0,296
Katrs (Paka ir 50) (bez PVN)
€ 0,358
Katrs (Paka ir 50) (Ieskaitot PVN)
50
€ 0,296
Katrs (Paka ir 50) (bez PVN)
€ 0,358
Katrs (Paka ir 50) (Ieskaitot PVN)
50
Pirkt iepakojumos
| Daudzums | Vienības cena | Per Iepakojums |
|---|---|---|
| 50 - 700 | € 0,296 | € 14,80 |
| 750 - 1450 | € 0,198 | € 9,90 |
| 1500 - 2950 | € 0,168 | € 8,40 |
| 3000 - 5950 | € 0,164 | € 8,20 |
| 6000+ | € 0,161 | € 8,05 |
Tehniskie dokumenti
Specifikācija
Brand
Lite-OnMounting Type
Surface Mount
Output Device
Transistor
Maximum Forward Voltage
1.4V
Number of Channels
1
Number of Pins
4
Package Type
SOIC
Input Current Type
DC
Typical Rise Time
2µs
Maximum Input Current
50 mA
Isolation Voltage
3750 Vrms
Maximum Current Transfer Ratio
600%
Typical Fall Time
3µs
Special Features
Double Transfer Mold Technology, Hybrid Substrates That Require High Density Mounting, Programmable Controllers, System Appliance
Produkta apraksts
Transistor Output Optocouplers, Lite-On
Single, Dual and Quad format transistor output optocouplers from Lite-On. This wide range of products includes devices with AC or DC inputs, and both through-hole and surface-mounting package options are available.