Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
€ 10.60
€ 10.60 Each (Exc. Vat)
€ 12.83
€ 12.83 Each (inc. VAT)
1
€ 10.60
€ 10.60 Each (Exc. Vat)
€ 12.83
€ 12.83 Each (inc. VAT)
Stock information temporarily unavailable.
1
Stock information temporarily unavailable.
| Quantity | Unit price | 
|---|---|
| 1 - 9 | € 10.60 | 
| 10 - 19 | € 10.20 | 
| 20 - 49 | € 9.80 | 
| 50+ | € 9.00 | 
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
