Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
€ 66.50
€ 66.50 Each (Exc. Vat)
€ 80.46
€ 80.46 Each (inc. VAT)
1
€ 66.50
€ 66.50 Each (Exc. Vat)
€ 80.46
€ 80.46 Each (inc. VAT)
Stock information temporarily unavailable.
1
Stock information temporarily unavailable.
Quantity | Unit price |
---|---|
1 - 9 | € 66.50 |
10 - 19 | € 64.00 |
20 - 49 | € 62.00 |
50+ | € 56.50 |
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips