Tehniskie dokumenti
Specifikācija
Brand
Amphenol ICCNumber Of Contacts
15
Gender
Male
Body Orientation
Straight
Mounting Type
Panel Mount
Pitch
2.29mm
D Connector Type
High Density D-Sub
D-Sub Shell Size
E
Termination Method
Solder
Current Rating
2.5A
Housing Material
Steel
Voltage Rating
250.0 V
Length
30.81mm
Width
4.8mm
Depth
12.55mm
Dimensions
30.81 x 4.8 x 12.55mm
Contact Plating
Gold over Nickel
Contact Material
Copper Alloy
Minimum Operating Temperature
-55.0°C
Maximum Operating Temperature
+105°C
Izcelsmes valsts
China
Produkta apraksts
D-Sub Compact HD Solder Bucket with Standard Hole
These FCI D-Subminiature High-Density connectors are suitable for applications requiring robust and reliable connectors such as Telecommunications, Data, Consumer, Industrial, Military, Instrumentation and Medical markets. The High-Density range gives Input - Output interconnects to meet all design requirements and addresses the increasing needs for high density packaging.
FCI Compact High Density D-Subminiature Connectors
The FCI High Density D-Subminiature range provides high-density and high-speed interfaces to enable interconnect technologies for storage and memory, networking and complementary products for power distribution. These High Density D-Subminiature connectors enable full compliance to industry standards, such as Ethernet, SFF, Infiniband, USB, PCMCIA or HDMI.
Noliktavas stāvoklis patreiz nav pieejams
Lūdzu pārbaudiet vēlreiz vēlāk
€ 1,35
Katrs (bez PVN)
€ 1,63
Katrs (Ieskaitot PVN)
1
€ 1,35
Katrs (bez PVN)
€ 1,63
Katrs (Ieskaitot PVN)
1
Pirkt iepakojumos
Daudzums | Vienības cena |
---|---|
1 - 24 | € 1,35 |
25 - 49 | € 0,90 |
50 - 99 | € 0,76 |
100 - 249 | € 0,66 |
250+ | € 0,58 |
Tehniskie dokumenti
Specifikācija
Brand
Amphenol ICCNumber Of Contacts
15
Gender
Male
Body Orientation
Straight
Mounting Type
Panel Mount
Pitch
2.29mm
D Connector Type
High Density D-Sub
D-Sub Shell Size
E
Termination Method
Solder
Current Rating
2.5A
Housing Material
Steel
Voltage Rating
250.0 V
Length
30.81mm
Width
4.8mm
Depth
12.55mm
Dimensions
30.81 x 4.8 x 12.55mm
Contact Plating
Gold over Nickel
Contact Material
Copper Alloy
Minimum Operating Temperature
-55.0°C
Maximum Operating Temperature
+105°C
Izcelsmes valsts
China
Produkta apraksts
D-Sub Compact HD Solder Bucket with Standard Hole
These FCI D-Subminiature High-Density connectors are suitable for applications requiring robust and reliable connectors such as Telecommunications, Data, Consumer, Industrial, Military, Instrumentation and Medical markets. The High-Density range gives Input - Output interconnects to meet all design requirements and addresses the increasing needs for high density packaging.
FCI Compact High Density D-Subminiature Connectors
The FCI High Density D-Subminiature range provides high-density and high-speed interfaces to enable interconnect technologies for storage and memory, networking and complementary products for power distribution. These High Density D-Subminiature connectors enable full compliance to industry standards, such as Ethernet, SFF, Infiniband, USB, PCMCIA or HDMI.