Heatsink, Universal Rectangular Alu, 0.14°C/W, 100 x 215 x 77mm, PCB Mount

RS noliktavas nr.: 903-3144Ražotājs: ABL ComponentsRažotāja kods: 180AB1000B
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Tehniskie dokumenti

Specifikācija

For Use With

Universal Rectangular Alu

Length

100mm

Width

215mm

Height

77mm

Dimensions

100 x 215 x 77mm

Thermal Resistance

0.14°C/W

Mounting

PCB Mount

Series

100

Material

Aluminium

Application

High Power Semiconductor Device, Optoelectronic Device

Finish

Anodized

Izcelsmes valsts

United Kingdom

Produkta apraksts

Heat Sink 180AB Series, 215mm Wide x 77mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

Noliktavas stāvoklis patreiz nav pieejams

€ 76,00

€ 76,00 Katrs (bez PVN)

€ 91,96

€ 91,96 Katrs (Ieskaitot PVN)

Heatsink, Universal Rectangular Alu, 0.14°C/W, 100 x 215 x 77mm, PCB Mount

€ 76,00

€ 76,00 Katrs (bez PVN)

€ 91,96

€ 91,96 Katrs (Ieskaitot PVN)

Heatsink, Universal Rectangular Alu, 0.14°C/W, 100 x 215 x 77mm, PCB Mount
Noliktavas stāvoklis patreiz nav pieejams

Noliktavas stāvoklis patreiz nav pieejams

Lūdzu pārbaudiet vēlreiz vēlāk

DaudzumsVienības cena
1 - 4€ 76,00
5 - 9€ 72,00
10 - 24€ 67,50
25 - 99€ 64,50
100+€ 43,00

Tehniskie dokumenti

Specifikācija

For Use With

Universal Rectangular Alu

Length

100mm

Width

215mm

Height

77mm

Dimensions

100 x 215 x 77mm

Thermal Resistance

0.14°C/W

Mounting

PCB Mount

Series

100

Material

Aluminium

Application

High Power Semiconductor Device, Optoelectronic Device

Finish

Anodized

Izcelsmes valsts

United Kingdom

Produkta apraksts

Heat Sink 180AB Series, 215mm Wide x 77mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.