Heatsink, D2 PAK (TO-263), Power SO-10 (MO-184), SO-10 Package Semiconductors, 15°C/W, 25.91 x 14.99 x 9.52mm,

RS noliktavas nr.: 880-6008Ražotājs: AAVID THERMALLOYRažotāja kods: 7106DG
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Tehniskie dokumenti

Specifikācija

Brand

AAVID THERMALLOY

For Use With

D2 PAK (TO-263), Power SO-10 (MO-184), SO-10 Package Semiconductors

Length

25.91mm

Width

14.99mm

Height

9.52mm

Dimensions

25.91 x 14.99 x 9.52mm

Thermal Resistance

15°C/W

Mounting

Horizontal

Series

7106

Package Type

SMT

Material

Aluminium

Application

Through Hole Discrete Semiconductors

Finish

Tin Plated

Special Features

The Device and the Heat Sink are Soldered Directly to a Modified Drain Pad Creating a Thermal Transfer Path from Package Tab to the Heat Sink

Izcelsmes valsts

China

Noliktavas stāvoklis patreiz nav pieejams

Lūdzu pārbaudiet vēlreiz vēlāk

Noliktavas stāvoklis patreiz nav pieejams

€ 1,25

Katrs (Paka ir 50) (bez PVN)

€ 1,512

Katrs (Paka ir 50) (Ieskaitot PVN)

Heatsink, D2 PAK (TO-263), Power SO-10 (MO-184), SO-10 Package Semiconductors, 15°C/W, 25.91 x 14.99 x 9.52mm,

50

Pieejams komplektos pa 50
50€ 62,50
100€ 125,00
150€ 187,50
200€ 250,00
250€ 312,50
300€ 375,00
350€ 437,50
400€ 500,00
450€ 562,50
500€ 625,00
550€ 687,50
600€ 750,00
650€ 812,50
700€ 875,00
750€ 937,50

€ 1,25

Katrs (Paka ir 50) (bez PVN)

€ 1,512

Katrs (Paka ir 50) (Ieskaitot PVN)

Heatsink, D2 PAK (TO-263), Power SO-10 (MO-184), SO-10 Package Semiconductors, 15°C/W, 25.91 x 14.99 x 9.52mm,
Noliktavas stāvoklis patreiz nav pieejams

50

Pieejams komplektos pa 50
50€ 62,50
100€ 125,00
150€ 187,50
200€ 250,00
250€ 312,50
300€ 375,00
350€ 437,50
400€ 500,00
450€ 562,50
500€ 625,00
550€ 687,50
600€ 750,00
650€ 812,50
700€ 875,00
750€ 937,50

Tehniskie dokumenti

Specifikācija

Brand

AAVID THERMALLOY

For Use With

D2 PAK (TO-263), Power SO-10 (MO-184), SO-10 Package Semiconductors

Length

25.91mm

Width

14.99mm

Height

9.52mm

Dimensions

25.91 x 14.99 x 9.52mm

Thermal Resistance

15°C/W

Mounting

Horizontal

Series

7106

Package Type

SMT

Material

Aluminium

Application

Through Hole Discrete Semiconductors

Finish

Tin Plated

Special Features

The Device and the Heat Sink are Soldered Directly to a Modified Drain Pad Creating a Thermal Transfer Path from Package Tab to the Heat Sink

Izcelsmes valsts

China