Tehniskie dokumenti
Specifikācija
Brand
KYOCERA AVXCapacitance
0.2pF
Tolerance
±0.1pF
Voltage
250V dc
Mounting Type
Surface Mount
Temperature Coefficient
0±30ppm/°C
Dielectric
Polymer
Package/Case
0603 (1608M)
Dimensions
1.6 x 0.838 x 0.635mm
Operating Temperature Range
-55 → +125 °C
Depth
0.84mm
Height
0.64mm
Length
1.6mm
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Produkta apraksts
AVX Multilayer Organic Capacitors, ML Series
Based on its patented multilayer low loss organic (MLO™) technology. These new capacitors represent a paradigm shift from traditional ceramic and thin film passive SMD components. Multilayer Organic Capacitors are polymer based capacitors that use high conductivity copper interconnects in a multilayer fashion.
Multilayer Organic Film Capacitors
Noliktavas stāvoklis patreiz nav pieejams
Lūdzu pārbaudiet vēlreiz vēlāk
€ 0,262
Katrs (tiek piegadats Rulli) (bez PVN)
€ 0,317
Katrs (tiek piegadats Rulli) (Ieskaitot PVN)
Industriālais iepakojums (Rullis)
100
€ 0,262
Katrs (tiek piegadats Rulli) (bez PVN)
€ 0,317
Katrs (tiek piegadats Rulli) (Ieskaitot PVN)
Industriālais iepakojums (Rullis)
100
Pirkt iepakojumos
Daudzums | Vienības cena | Per Rullis |
---|---|---|
100 - 240 | € 0,262 | € 2,62 |
250 - 490 | € 0,238 | € 2,38 |
500 - 990 | € 0,218 | € 2,18 |
1000+ | € 0,201 | € 2,01 |
Tehniskie dokumenti
Specifikācija
Brand
KYOCERA AVXCapacitance
0.2pF
Tolerance
±0.1pF
Voltage
250V dc
Mounting Type
Surface Mount
Temperature Coefficient
0±30ppm/°C
Dielectric
Polymer
Package/Case
0603 (1608M)
Dimensions
1.6 x 0.838 x 0.635mm
Operating Temperature Range
-55 → +125 °C
Depth
0.84mm
Height
0.64mm
Length
1.6mm
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Produkta apraksts
AVX Multilayer Organic Capacitors, ML Series
Based on its patented multilayer low loss organic (MLO™) technology. These new capacitors represent a paradigm shift from traditional ceramic and thin film passive SMD components. Multilayer Organic Capacitors are polymer based capacitors that use high conductivity copper interconnects in a multilayer fashion.