Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass, 28.96 x 20.57mm
Tehniskie dokumenti
Specifikācija
Brand
BergquistDimensions
28.96 x 20.57mm
Thickness
0.015in
Length
28.96mm
Width
20.57mm
Thermal Conductivity
3.5W/m·K
Material
Fibreglass
Minimum Operating Temperature
-60°C
Maximum Operating Temperature
+200°C
Hardness
Shore A 90
Material Trade Name
Sil-Pad 2000
Operating Temperature Range
-60 → +200 °C
Izcelsmes valsts
United States
Produkta apraksts
Bergquist Sil-Pad 2000
Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.
Noliktavas stāvoklis patreiz nav pieejams
Lūdzu pārbaudiet vēlreiz vēlāk
€ 31,00
€ 3,10 Katrs (Paka ir 10) (bez PVN)
€ 37,51
€ 3,751 Katrs (Paka ir 10) (Ieskaitot PVN)
10
€ 31,00
€ 3,10 Katrs (Paka ir 10) (bez PVN)
€ 37,51
€ 3,751 Katrs (Paka ir 10) (Ieskaitot PVN)
10
Pirkt iepakojumos
| Daudzums | Vienības cena | Per Iepakojums |
|---|---|---|
| 10 - 40 | € 3,10 | € 31,00 |
| 50 - 190 | € 3,00 | € 30,00 |
| 200 - 490 | € 2,75 | € 27,50 |
| 500 - 990 | € 2,70 | € 27,00 |
| 1000+ | € 2,60 | € 26,00 |
Tehniskie dokumenti
Specifikācija
Brand
BergquistDimensions
28.96 x 20.57mm
Thickness
0.015in
Length
28.96mm
Width
20.57mm
Thermal Conductivity
3.5W/m·K
Material
Fibreglass
Minimum Operating Temperature
-60°C
Maximum Operating Temperature
+200°C
Hardness
Shore A 90
Material Trade Name
Sil-Pad 2000
Operating Temperature Range
-60 → +200 °C
Izcelsmes valsts
United States
Produkta apraksts
Bergquist Sil-Pad 2000
Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.