Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass, 11.1 x 7.92mm
Tehniskie dokumenti
Specifikācija
Brand
BergquistDimensions
11.1 x 7.92mm
Thickness
0.015in
Length
11.1mm
Width
7.92mm
Thermal Conductivity
3.5W/m·K
Material
Fibreglass
Minimum Operating Temperature
-60°C
Maximum Operating Temperature
+200°C
Hardness
Shore A 90
Material Trade Name
Sil-Pad 2000
Operating Temperature Range
-60 → +200 °C
Izcelsmes valsts
United States
Produkta apraksts
Bergquist Sil-Pad 2000
Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.
€ 12,50
€ 1,25 Katrs (Paka ir 10) (bez PVN)
€ 15,12
€ 1,512 Katrs (Paka ir 10) (Ieskaitot PVN)
10
€ 12,50
€ 1,25 Katrs (Paka ir 10) (bez PVN)
€ 15,12
€ 1,512 Katrs (Paka ir 10) (Ieskaitot PVN)
Noliktavas stāvoklis patreiz nav pieejams
10
Noliktavas stāvoklis patreiz nav pieejams
| Daudzums | Vienības cena | Per Iepakojums |
|---|---|---|
| 10 - 40 | € 1,25 | € 12,50 |
| 50 - 240 | € 1,10 | € 11,00 |
| 250 - 490 | € 0,995 | € 9,95 |
| 500 - 990 | € 0,948 | € 9,48 |
| 1000+ | € 0,92 | € 9,20 |
Tehniskie dokumenti
Specifikācija
Brand
BergquistDimensions
11.1 x 7.92mm
Thickness
0.015in
Length
11.1mm
Width
7.92mm
Thermal Conductivity
3.5W/m·K
Material
Fibreglass
Minimum Operating Temperature
-60°C
Maximum Operating Temperature
+200°C
Hardness
Shore A 90
Material Trade Name
Sil-Pad 2000
Operating Temperature Range
-60 → +200 °C
Izcelsmes valsts
United States
Produkta apraksts
Bergquist Sil-Pad 2000
Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.