Tehniskie dokumenti
Specifikācija
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
2
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Current Rating
3.0A
Series Number
55932
Voltage Rating
250.0 V
Izcelsmes valsts
Japan
Produkta apraksts
Single Row Vertical Header with Boss
A range of 2.00mm Pitch MicroClasp™ Wire-to-Board Headers with Boss.
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
€ 3,63
€ 0,363 Katrs (Paka ir 10) (bez PVN)
€ 4,39
€ 0,439 Katrs (Paka ir 10) (Ieskaitot PVN)
Standarts
10
€ 3,63
€ 0,363 Katrs (Paka ir 10) (bez PVN)
€ 4,39
€ 0,439 Katrs (Paka ir 10) (Ieskaitot PVN)
Standarts
10
Noliktavas stāvoklis patreiz nav pieejams
Lūdzu pārbaudiet vēlreiz vēlāk
Daudzums | Vienības cena | Per Iepakojums |
---|---|---|
10 - 240 | € 0,363 | € 3,63 |
250 - 990 | € 0,267 | € 2,67 |
1000 - 4990 | € 0,208 | € 2,08 |
5000 - 9990 | € 0,193 | € 1,93 |
10000+ | € 0,182 | € 1,82 |
Tehniskie dokumenti
Specifikācija
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
2
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Current Rating
3.0A
Series Number
55932
Voltage Rating
250.0 V
Izcelsmes valsts
Japan
Produkta apraksts
Single Row Vertical Header with Boss
A range of 2.00mm Pitch MicroClasp™ Wire-to-Board Headers with Boss.
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.