Tehniskie dokumenti
Specifikācija
Brand
Laird TechnologiesDimensions
100 x 100mm
Thickness
5mm
Length
100mm
Width
100mm
Thermal Conductivity
1.2W/m·K
Material
Ceramic Filled Silicone Rubber
Self-Adhesive
Yes
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
+160°C
Hardness
Shore OO 27
Operating Temperature Range
-40 → +160 °C
Izcelsmes valsts
Czech Republic
Produkta apraksts
T-flex 300 & 3000
T-flex™ 300 is a silicone gel combined with a ceramic powder to offer a unique combination of compliancy, thermal resistance and price. At pressures of 50 psi, it deflects over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set, enabling the pad to be reused many times. Low thermal resistances can be achieved at low pressures.
€ 12,70
€ 12,70 Katrs (bez PVN)
€ 15,37
€ 15,37 Katrs (Ieskaitot PVN)
1
€ 12,70
€ 12,70 Katrs (bez PVN)
€ 15,37
€ 15,37 Katrs (Ieskaitot PVN)
Noliktavas stāvoklis patreiz nav pieejams
1
Noliktavas stāvoklis patreiz nav pieejams
| Daudzums | Vienības cena |
|---|---|
| 1 - 49 | € 12,70 |
| 50 - 99 | € 11,30 |
| 100 - 249 | € 10,00 |
| 250 - 499 | € 9,40 |
| 500+ | € 9,10 |
Tehniskie dokumenti
Specifikācija
Brand
Laird TechnologiesDimensions
100 x 100mm
Thickness
5mm
Length
100mm
Width
100mm
Thermal Conductivity
1.2W/m·K
Material
Ceramic Filled Silicone Rubber
Self-Adhesive
Yes
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
+160°C
Hardness
Shore OO 27
Operating Temperature Range
-40 → +160 °C
Izcelsmes valsts
Czech Republic
Produkta apraksts
T-flex 300 & 3000
T-flex™ 300 is a silicone gel combined with a ceramic powder to offer a unique combination of compliancy, thermal resistance and price. At pressures of 50 psi, it deflects over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set, enabling the pad to be reused many times. Low thermal resistances can be achieved at low pressures.
