TDK 330nF Multilayer Ceramic Capacitor MLCC, 250V dc V, ±10% , SMD

RS noliktavas nr.: 916-3059PRažotājs: TDKRažotāja kods: C3225X7T2E334K200AA
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Tehniskie dokumenti

Specifikācija

Brand

TDK

Capacitance

330nF

Voltage

250V dc

Package/Case

1210 (3225M)

Mounting Type

Surface Mount

Dielectric

X7T

Tolerance

±10%

Dimensions

3.2 x 2.5 x 2mm

Length

3.2mm

Depth

2.5mm

Height

2mm

Series

C

Maximum Operating Temperature

+125°C

Minimum Operating Temperature

-55°C

Terminal Type

Surface Mount

Produkta apraksts

TDK Type 1210 Series C3225

MLCC C Series is a monolithic structure that ensures superior mechanical strength and reliability.
High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.

Noliktavas stāvoklis patreiz nav pieejams

€ 26,50

€ 0,265 Katrs (tiek piegadats Rulli) (bez PVN)

€ 32,06

€ 0,321 Katrs (tiek piegadats Rulli) (Ieskaitot PVN)

TDK 330nF Multilayer Ceramic Capacitor MLCC, 250V dc V, ±10% , SMD
Izvēlēties iepakojuma veidu

€ 26,50

€ 0,265 Katrs (tiek piegadats Rulli) (bez PVN)

€ 32,06

€ 0,321 Katrs (tiek piegadats Rulli) (Ieskaitot PVN)

TDK 330nF Multilayer Ceramic Capacitor MLCC, 250V dc V, ±10% , SMD
Noliktavas stāvoklis patreiz nav pieejams
Izvēlēties iepakojuma veidu

Noliktavas stāvoklis patreiz nav pieejams

Lūdzu pārbaudiet vēlreiz vēlāk

DaudzumsVienības cenaPer Rullis
100 - 180€ 0,265€ 5,30
200 - 480€ 0,246€ 4,92
500 - 980€ 0,225€ 4,50
1000+€ 0,205€ 4,10

Tehniskie dokumenti

Specifikācija

Brand

TDK

Capacitance

330nF

Voltage

250V dc

Package/Case

1210 (3225M)

Mounting Type

Surface Mount

Dielectric

X7T

Tolerance

±10%

Dimensions

3.2 x 2.5 x 2mm

Length

3.2mm

Depth

2.5mm

Height

2mm

Series

C

Maximum Operating Temperature

+125°C

Minimum Operating Temperature

-55°C

Terminal Type

Surface Mount

Produkta apraksts

TDK Type 1210 Series C3225

MLCC C Series is a monolithic structure that ensures superior mechanical strength and reliability.
High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.