Tehniskie dokumenti
Specifikācija
Brand
onsemiTransistor Type
NPN
Maximum DC Collector Current
500 mA
Maximum Collector Emitter Voltage
40 V
Package Type
SOIC
Mounting Type
Surface Mount
Maximum Power Dissipation
1 W
Minimum DC Current Gain
100
Transistor Configuration
Isolated
Maximum Collector Base Voltage
75 V
Maximum Emitter Base Voltage
5 V
Maximum Operating Frequency
300 MHz
Pin Count
16
Number of Elements per Chip
4
Maximum Operating Temperature
+150 °C
Dimensions
10 x 4 x 1.5mm
Produkta apraksts
Dual & Quad Multi-Chip Transistors, Fairchild Semiconductor
Bipolar Transistors, Fairchild Semiconductor
Bipolar Junction Transistors (BJT) broad range provides complete solutions for various circuit application needs. Innovative packages are designed for minimal size, highest reliability and maximum thermal performance.
€ 10,50
€ 2,10 Katrs (Paka ir 5) (bez PVN)
€ 12,70
€ 2,541 Katrs (Paka ir 5) (Ieskaitot PVN)
Standarts
5
€ 10,50
€ 2,10 Katrs (Paka ir 5) (bez PVN)
€ 12,70
€ 2,541 Katrs (Paka ir 5) (Ieskaitot PVN)
Standarts
5
Noliktavas stāvoklis patreiz nav pieejams
Lūdzu pārbaudiet vēlreiz vēlāk
Daudzums | Vienības cena | Per Iepakojums |
---|---|---|
5 - 45 | € 2,10 | € 10,50 |
50 - 95 | € 1,80 | € 9,00 |
100 - 495 | € 1,55 | € 7,75 |
500 - 995 | € 1,40 | € 7,00 |
1000+ | € 1,25 | € 6,25 |
Tehniskie dokumenti
Specifikācija
Brand
onsemiTransistor Type
NPN
Maximum DC Collector Current
500 mA
Maximum Collector Emitter Voltage
40 V
Package Type
SOIC
Mounting Type
Surface Mount
Maximum Power Dissipation
1 W
Minimum DC Current Gain
100
Transistor Configuration
Isolated
Maximum Collector Base Voltage
75 V
Maximum Emitter Base Voltage
5 V
Maximum Operating Frequency
300 MHz
Pin Count
16
Number of Elements per Chip
4
Maximum Operating Temperature
+150 °C
Dimensions
10 x 4 x 1.5mm
Produkta apraksts
Dual & Quad Multi-Chip Transistors, Fairchild Semiconductor
Bipolar Transistors, Fairchild Semiconductor
Bipolar Junction Transistors (BJT) broad range provides complete solutions for various circuit application needs. Innovative packages are designed for minimal size, highest reliability and maximum thermal performance.