Tehniskie dokumenti
Specifikācija
Brand
TE ConnectivityType
Open Top
Number Of Contacts
2
Pitch
2.54mm
Gender
Female
Colour
Green
Number Of Rows
1
Length
5.08mm
Width
2.54mm
Depth
6.3mm
Series
AMPMODU Mod IV
Contact Material
Beryllium Copper
Contact Plating
Gold over Nickel
Orientation
Straight
Izcelsmes valsts
France
Produkta apraksts
Shunt Connector
Suitable for applications such as linking 2 adjacent header pins on a standard 2.54mm pitch. Will mate with 0.64mm round or square posts.Glass filled polyester insulation, with tin plated beryllium copper contacts.
2.54mm TE Connectivity AMPMODU™ Range – Style 2 (European)
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.
Noliktavas stāvoklis patreiz nav pieejams
Lūdzu pārbaudiet vēlreiz vēlāk
€ 0,945
Katrs (Paka ir 10) (bez PVN)
€ 1,143
Katrs (Paka ir 10) (Ieskaitot PVN)
Standarts
10
€ 0,945
Katrs (Paka ir 10) (bez PVN)
€ 1,143
Katrs (Paka ir 10) (Ieskaitot PVN)
Standarts
10
Pirkt iepakojumos
Daudzums | Vienības cena | Per Iepakojums |
---|---|---|
10 - 190 | € 0,945 | € 9,45 |
200 - 740 | € 0,852 | € 8,52 |
750 - 2990 | € 0,679 | € 6,79 |
3000 - 5990 | € 0,531 | € 5,31 |
6000+ | € 0,501 | € 5,01 |
Tehniskie dokumenti
Specifikācija
Brand
TE ConnectivityType
Open Top
Number Of Contacts
2
Pitch
2.54mm
Gender
Female
Colour
Green
Number Of Rows
1
Length
5.08mm
Width
2.54mm
Depth
6.3mm
Series
AMPMODU Mod IV
Contact Material
Beryllium Copper
Contact Plating
Gold over Nickel
Orientation
Straight
Izcelsmes valsts
France
Produkta apraksts
Shunt Connector
Suitable for applications such as linking 2 adjacent header pins on a standard 2.54mm pitch. Will mate with 0.64mm round or square posts.Glass filled polyester insulation, with tin plated beryllium copper contacts.
2.54mm TE Connectivity AMPMODU™ Range – Style 2 (European)
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.