TDK 470nF Multilayer Ceramic Capacitor MLCC, 630V dc V, ±10% , SMD

RS noliktavas nr.: 904-0173Ražotājs: TDKRažotāja kods: C5750X7T2J474K250KC
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Tehniskie dokumenti

Specifikācija

Brand

TDK

Capacitance

470nF

Voltage

630V dc

Package/Case

2220 (5750M)

Mounting Type

Surface Mount

Dielectric

X7T

Tolerance

±10%

Dimensions

5.7 x 5 x 2.8mm

Length

5.7mm

Depth

5mm

Height

2.8mm

Series

C5750

Maximum Operating Temperature

+125°C

Minimum Operating Temperature

-55°C

Terminal Type

Surface Mount

Izcelsmes valsts

Japan

Produkta apraksts

TDK C type 2220 series

Professional range of TDK multilayer ceramic chip capacitors from the C series. The C series offers excellent mechanical strength and reliability due to their monolithic structure. High capacitance is delivered by using multiple thinner ceramic layers. Suitable for high frequency and high density type power supplies due to low ESR and excellent frequency characteristics.

Noliktavas stāvoklis patreiz nav pieejams

€ 4,60

€ 2,30 Katrs (Paka ir 2) (bez PVN)

€ 5,57

€ 2,783 Katrs (Paka ir 2) (Ieskaitot PVN)

TDK 470nF Multilayer Ceramic Capacitor MLCC, 630V dc V, ±10% , SMD

€ 4,60

€ 2,30 Katrs (Paka ir 2) (bez PVN)

€ 5,57

€ 2,783 Katrs (Paka ir 2) (Ieskaitot PVN)

TDK 470nF Multilayer Ceramic Capacitor MLCC, 630V dc V, ±10% , SMD
Noliktavas stāvoklis patreiz nav pieejams

Noliktavas stāvoklis patreiz nav pieejams

Lūdzu pārbaudiet vēlreiz vēlāk

Tehniskie dokumenti

Specifikācija

Brand

TDK

Capacitance

470nF

Voltage

630V dc

Package/Case

2220 (5750M)

Mounting Type

Surface Mount

Dielectric

X7T

Tolerance

±10%

Dimensions

5.7 x 5 x 2.8mm

Length

5.7mm

Depth

5mm

Height

2.8mm

Series

C5750

Maximum Operating Temperature

+125°C

Minimum Operating Temperature

-55°C

Terminal Type

Surface Mount

Izcelsmes valsts

Japan

Produkta apraksts

TDK C type 2220 series

Professional range of TDK multilayer ceramic chip capacitors from the C series. The C series offers excellent mechanical strength and reliability due to their monolithic structure. High capacitance is delivered by using multiple thinner ceramic layers. Suitable for high frequency and high density type power supplies due to low ESR and excellent frequency characteristics.