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Bergquist Thermal Interface Pad, 0.152mm Thick, 1.1W/m·K, Thin Film Polyimide, 19.05 x 12.7mm

RS noliktavas nr.: 468-2230Ražotājs: BergquistRažotāja kods: SPK6-0.006-00-54
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Specifikācija

Dimensions

19.05 x 12.7mm

Thickness

0.152mm

Length

19.05mm

Width

12.7mm

Thermal Conductivity

1.1W/m·K

Material

Thin Film Polyimide

Minimum Operating Temperature

-60°C

Maximum Operating Temperature

+180°C

Hardness

Shore A 90

Material Trade Name

Sil-Pad K6

Operating Temperature Range

-60 → +180 °C

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P.O.A.

Bergquist Thermal Interface Pad, 0.152mm Thick, 1.1W/m·K, Thin Film Polyimide, 19.05 x 12.7mm

P.O.A.

Bergquist Thermal Interface Pad, 0.152mm Thick, 1.1W/m·K, Thin Film Polyimide, 19.05 x 12.7mm
Noliktavas stāvoklis patreiz nav pieejams

Noliktavas stāvoklis patreiz nav pieejams

Lūdzu pārbaudiet vēlreiz vēlāk

Jūs varētu interesēt

Tehniskie dokumenti

Specifikācija

Dimensions

19.05 x 12.7mm

Thickness

0.152mm

Length

19.05mm

Width

12.7mm

Thermal Conductivity

1.1W/m·K

Material

Thin Film Polyimide

Minimum Operating Temperature

-60°C

Maximum Operating Temperature

+180°C

Hardness

Shore A 90

Material Trade Name

Sil-Pad K6

Operating Temperature Range

-60 → +180 °C

Jūs varētu interesēt