Tehniskie dokumenti
Specifikācija
Brand
TE ConnectivityPlug/Socket
Socket
Gender
Female
Mounting Type
Through Hole
Termination Method
Press-In
Contact Material
Phosphor Bronze
Housing Material
PET
Contact Plating
Gold over Palladium Nickel over Nickel
Izcelsmes valsts
United States
Produkta apraksts
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
Noliktavas stāvoklis patreiz nav pieejams
Lūdzu pārbaudiet vēlreiz vēlāk
€ 7,60
€ 7,60 Katrs (bez PVN)
€ 9,20
€ 9,20 Katrs (Ieskaitot PVN)
Standarts
1
€ 7,60
€ 7,60 Katrs (bez PVN)
€ 9,20
€ 9,20 Katrs (Ieskaitot PVN)
Standarts
1
Tehniskie dokumenti
Specifikācija
Brand
TE ConnectivityPlug/Socket
Socket
Gender
Female
Mounting Type
Through Hole
Termination Method
Press-In
Contact Material
Phosphor Bronze
Housing Material
PET
Contact Plating
Gold over Palladium Nickel over Nickel
Izcelsmes valsts
United States
Produkta apraksts
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.