Steel Mechanical Brushed Code Lock

TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Double Row Board to Board Vertical Headers

AMPMODU 50/50 double row board to board SMT PCB mount vertical headers with a high density 1.27mm x 1.27mm centerline and a 6.35mm mated height for parallel board to board applications. These AMPMODU 50/50 board to board headers have metallic board holddowns, dual beam receptacle contacts and black UL 94V-0 LCP housings with keying to aid accurate mating.

TE Connectivity AMPMODU 50/50 1.27mm Connectors

The TE Connectivity Modu 50/50 is a high density 1.27mm grid board to board connection system for SMT assembly. Choice of three different heights for PCB headers allows versatile stacking solutions to be achieved.