Bergquist Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 25.4 x 19.05mm

RS noliktavas nr.: 468-2735Ražotājs: BergquistRažotāja kods: SPK10-0.006-00104
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Specifikācija

Brand

Bergquist

Dimensions

25.4 x 19.05mm

Thickness

0.152mm

Length

25.4mm

Width

19.05mm

Thermal Conductivity

1.3W/m·K

Material

Thin Film Polyimide

Minimum Operating Temperature

-60°C

Maximum Operating Temperature

+180°C

Hardness

Shore A 90

Material Trade Name

Sil-Pad K10

Operating Temperature Range

-60 → +180 °C

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Bergquist Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 25.4 x 19.05mm

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P.O.A.

Bergquist Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 25.4 x 19.05mm
Noliktavas stāvoklis patreiz nav pieejams

1

Pieejams komplektos pa 1
1P.O.A.
2P.O.A.
3P.O.A.
4P.O.A.
5P.O.A.
6P.O.A.
7P.O.A.
8P.O.A.
9P.O.A.
10P.O.A.
11P.O.A.
12P.O.A.
13P.O.A.
14P.O.A.
15P.O.A.
Jūs varētu interesēt

Tehniskie dokumenti

Specifikācija

Brand

Bergquist

Dimensions

25.4 x 19.05mm

Thickness

0.152mm

Length

25.4mm

Width

19.05mm

Thermal Conductivity

1.3W/m·K

Material

Thin Film Polyimide

Minimum Operating Temperature

-60°C

Maximum Operating Temperature

+180°C

Hardness

Shore A 90

Material Trade Name

Sil-Pad K10

Operating Temperature Range

-60 → +180 °C

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